{"id":19056,"date":"2026-06-25T21:45:47","date_gmt":"2026-06-25T20:45:47","guid":{"rendered":"https:\/\/innovatenews.site\/index.php\/2026\/06\/25\/forget-2nm-chips-ibm-just-beat-tsmc-to-sub-nm-chip-design\/"},"modified":"2026-06-25T21:45:49","modified_gmt":"2026-06-25T20:45:49","slug":"forget-2nm-chips-ibm-just-beat-tsmc-to-sub-nm-chip-design","status":"publish","type":"post","link":"https:\/\/innovatenews.site\/index.php\/2026\/06\/25\/forget-2nm-chips-ibm-just-beat-tsmc-to-sub-nm-chip-design\/","title":{"rendered":"Forget 2nm chips! IBM just beat TSMC to sub-nm chip design"},"content":{"rendered":"
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The topic Forget 2nm chips! IBM just beat TSMC to sub-nm chip design<\/strong> is currently the subject of lively discussion \u2014 readers and analysts are keeping a close eye on developments.<\/p>\n

This is taking place in a dynamic environment: companies\u2019 decisions and competitors\u2019 reactions can quickly change the picture.<\/p>\n

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Only a few years back, we were still looking forward to smartphone chips manufactured on a 2nm process as the next big thing. Fabrication advancements have now made 2nm chips a reality \u2014 so what\u2019s next? Engineers have already been pushing the limits of physics for a while now, and although they\u2019re probably going to come up against a wall at some point, we\u2019re not there quite yet, as IBM announces its new 0.7nm solution.<\/p>\n

A smaller and smaller fabrication level isn\u2019t the only factor that impacts chip performance, but it\u2019s nonetheless still a very important one. As we go smaller, not only can manufacturers fit more chips on the same silicon wafer, but those chips have the potential to run faster and cooler, thanks to more compact designs and shorter paths for data to travel.<\/p>\n

IBM\u2019s solution employs a 3D \u201cnanostack\u201d architecture, staggering transistor placement as the chip is built out vertically.<\/p>\n

Before you start getting too excited, though, there\u2019s a big difference between showing that a chip design like this is possible, and being ready to start cranking out 0.7nm Snapdragon or Exynos chips. As Neowin points out, IBM was first to show off 2nm chips, back in 2021, but it didn\u2019t end up being the company that ultimately made that kind of fabrication commercially viable.<\/p>\n

That means that this accomplishment is less a direct preview of where chips are immediately going next, and more a technical demonstration of what\u2019s possible on the horizon. IBM says that this sub-nm tech could conceivably be production-ready in something like 5 years.<\/p>\n

Even if that means we\u2019ve got a nice, long wait ahead of us before there\u2019s even a remote chance of seeing anything like this in our phones, IBM\u2019s advancement is still very good news to get. As you can see in the company\u2019s imagery above, we are making chips at a level where you can count the individual atoms in the logic gates, and it\u2019s just getting less and less possible to find new ways to build them smaller. For the sake of our future devices, we\u2019re just glad that talented engineers are still dreaming up new ways to get us there.<\/p>\n

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